• Biyapay

    Tool Loadport Station(TLP)
    For non-vacuum environments housing wafers, a positive pressure and closed-loop control system are employed for purging, utilizing the fab's power system (N2/XCDA). For the first time in China, MeetFuture's TLP1.0 has significantly reduced the humidity of FOUP to below RH1% in a remarkably short time.

    Optional configuration: Standard position sensor, temperature and humidity sensor, pressure gauge, flowmeter, optional MFC
    Feature Highlights:

    User-friendly man-machine interface

    Stable system integration

    Stand-alone control board

    High-speed purge

    Compatibility with multiple EAP communications

    Software Description
    TLP Software
    TLP Software
    An intelligent, efficient, stable, and professional host software, coupled with a customized purging strategy and comprehensive status monitoring, ensures the cleanliness and humidity stability within the wafer cassette, thereby preserving the wafer's characteristics and quality.

    Feature Highlights:
    ▪ Supports standard three-stage purging control.
    ▪ With FabScope, it can display the current operational status information of all equipment.
    Important Parameters
    Technical IndicatorsParameters
    Clean Grade≤Class100
    Filtration Precision0.003um
    Power Source220V，50Hz，2A


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